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We are always looking to add talented and passionate individuals who align with our mission

Smart Metal Modules

The first advanced packaging platform built on a metal substrate

Domestic US Production

Supply chain security

Compatible with existing wafer toolsets

Potential for panel-based manufacturing

Reduced Size, Weight, and Power

Simplified design

Thinnest substrate in class

High density routing for advanced chiplets

Improved Thermals

High thermal conductivity substrate to dissipate heat from densely packed chips

Ultra High Frequency Performance

Low loss interconnects for millimeter wave RF

Patented coaxial Through-Metal Vias with near-zero crosstalk

Rigid or Flexible

Platform

Low warpage substrate provides rigidity down to 100 µm thickness

Ultra thin (<25 µm) options available to support flexible applications

Proudly Supported By

Lux News

Catch up on the latest news & updates here

20 February 2023 • Press Release

Lux Semiconductors raises $2.3 million in seed funding for System-on-Foil semiconductor platform

02 February 2022 • News Article

Semiconductor startup takes space at Albany NanoTech to prep for commercialization

25 October 2021 • News Article

SpaceWERX ready to propel space innovation

21 September 2021 • News Article

SUNY Poly alumni spinoff Lux Semiconductors awarded $1.7M by U.S. Space Force

14 May 2021 • News Article

Albany semiconductor startup prepares to hire, scale up

08 June 2020 • News Article

Techstars space accelerators announce 2020 startups

02 June 2020 • News Article

Wright Brothers Institute identifies companies chosen for second round of T3 Transition Accelerator

Founders

Shane McMahon 

Co-Founder & CEO

Ph.D. Nanoscale Engineering

SUNY Poly

  • LinkedIn

Graeme Housser

Co-Founder & CTO

Ph.D. Nanoscale Engineering

SUNY Poly

  • LinkedIn
Our Mission

To chart a new course of system-level innovation for the semiconductor industry.

Our Vision

To build America's next great technology company by reimagining how electronics are made.

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