Smart Metal Modules
The first advanced packaging platform built on a metal substrate
Domestic US Production
Supply chain security
Compatible with existing wafer toolsets
Potential for panel-based manufacturing
Reduced Size, Weight, and Power
Simplified design
Thinnest substrate in class
High density routing for advanced chiplets
Improved Thermals
High thermal conductivity substrate to dissipate heat from densely packed chips
Ultra High Frequency Performance
Low loss interconnects for millimeter wave RF
Patented coaxial Through-Metal Vias with near-zero crosstalk
Rigid or Flexible
Platform
Low warpage substrate provides rigidity down to 100 µm thickness
Ultra thin (<25 µm) options available to support flexible applications
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Founders
Shane McMahon
Co-Founder & CEO
Ph.D. Nanoscale Engineering
SUNY Poly
Graeme Housser
Co-Founder & CTO
Ph.D. Nanoscale Engineering
SUNY Poly
Our Mission
To chart a new course of system-level innovation for the semiconductor industry.
Our Vision
To build America's next great technology company by reimagining how electronics are made.