Substrates that unlock the true potential of advanced packaging
Substrates have been the Achilles’ heel of the advanced packaging revolution. No more. Our metal substrates and interposers dramatically improve thermal dissipation and reduce warpage for your system-in-package (SiP) designs.
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100x
Higher thermal conductivity than Glass
13x
More resistant to warpage (stiffer) than Organics
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Why Metal?
Chip packages are growing in size, towards bigger and bigger superchips, and this places incredible demands on the package substrate. It must remain perfectly flat across varying temperatures and be able to deliver ample amounts of low loss power. A rigid, low-CTE metal substrate offers all of these in one platform.
TECHNOLOGY
Patented Coaxial Through Metal Vias
The metal package itself acts as an electromagnetic shield for signal lines running through it, completely eliminating cross-talk within the substrate.
The ample amount of stable ground metal also means that low loss power delivery networks can be patterned directly in the metal substrate.
Through Metal Via
Through Glass Via
Through Package Via
Advanced Packaging Designs with Zero Compromise
Think Beyond 2D and 2.5D. We enable True 3D SiP
Want to stack memory on top of a processor? With Lux’s metal technology, heat buildup is no longer a limiting factor.
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The First Choice, from Defense to Commercial
Lux’s breakthrough technology was developed to meet next-generation defense needs. It has received strong interest and support from the top 5 defense contractors. Now we are scaling for commercial applications and are prioritizing partnerships with manufacturers in fields including:
Artificial Intelligence
Autonomous Vehicles
Advanced Healthcare
"Modern DoD electronics must support on-device compute, high-bandwidth memory, and power-efficient communication links, all while meeting stringent size, weight, and power constraints. Metal core substrates, a technology class being pioneered by Lux Semiconductors, offer enhanced thermal management and high speed signal routing, for many critical applications, from aircraft, space assets, and terrestrial vehicles."
Rick Stevens | Senior Fellow
Lockheed Martin Advanced Technology Laboratories
Drop-In Replacement, Made in the USA
There’s a reason the industry is shifting to SiP designs. Use our metal substrates as a drop-in replacement for your current substrates and solve your key remaining SiP challenge. We leave glass and organics in the dust. Even better? We manufacture in the USA.
Want all the details of how metal substrates can solve your hardest SiP design frustrations? Request our full white paper below.
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Design Rules
Organic to Metal Substrate Design Transfer Guideline
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01
Layer Structure
  • Simple Conversion: Replace only the core layer; build-up layers remain the same.
  • Reduced Layers: Single metal core replaces two laminate layers, reducing total layers by one (e.g., 5-2-5 to 5-1-5).
  • Easy Integration: Use standard EDA tools like Cadence APD or Siemens XPD.
02
Via Configuration
  • Power and Ground: No core vias needed; build-up vias land directly on the metal core for ground and isolated planes for power.
  • Isolated Nets (I/O & Supply): Small vias pass through the metal core with isolation rings.
  • High-Speed I/O: Coaxial vias maintain characteristic impedance through the metal core.
03
Process Flow Overview
  • Redefine Layer Stack-Up: Replace 2 core layers with 1 metal layer; keep build-up layers unchanged.
  • Update Core Via Definitions: Swap organic vias (PTH) with metal vias (TMV) for power/ground, standard I/O, and high-speed I/O.
  • Modify Layout: Remove unnecessary PTH vias; replace others with the appropriate TMV vias.
ABOUT
Partnership for the Future
We see the future, and it’s going to need a lot of computing power. But the relentless push to performance that is driving the semiconductor industry from System-on-Chip to System-in-Package designs has been challenged by the drawbacks of conventional substrates like organics and glass.
Our revolutionary Smart Metal Substrate technology breaks through the barriers to provide the industry ‘More than Moore’ gains and enable chip architecture with more than enough computational strength to power tomorrow’s economy.
We are dedicated engineers and hard-working partners with everyone who is creating next-generation solutions.
Reach out to us today for more information, to get on our waitlist, or to explore our open positions.
Contact Us
Our Founders
Shane McMahon
Co-Founder and CEO
Ph.D. Nanoscale Engineering
Graeme Housser
Co-Founder and CTO
Ph.D. Nanoscale Engineering
CONTACT
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